基本信息
This electronic grade glass fiber cloth is specially designed for printed circuit board (PCB) packaging, made of high-purity alkali-free glass fiber woven with epoxy resin pre-impregnation. It solves the pain points of traditional packaging materials such as unstable dielectric properties and insufficient high-temperature resistance, suitable for high-end consumer electronics, communication base station PCB and other scenarios, effectively improving circuit stability and service life.