基本信息
This polyimide-based prepreg for electronic packaging is a high-performance composite preform specially developed for high-end electronic packaging and insulating components. It uses quartz fiber and polyimide matrix, with excellent insulation performance, high temperature resistance and dielectric stability. It is suitable for scenarios such as semiconductor packaging substrates and high-frequency electronic component insulation layers, solving the pain points of traditional electronic packaging materials such as insufficient high temperature resistance and unstable dielectric performance, helping high-end electronic equipment achieve lightweight and high-reliability design goals.
发布询价
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