基本信息
This electronic-grade ethylene urea curing auxiliary is specially developed for semiconductor packaging and electronic component potting materials. It can be used as a curing accelerator to improve the curing efficiency and adhesion of epoxy potting glue, while capturing trace formaldehyde released during the packaging process, improving the reliability and environmental protection of electronic products. It adapts to the packaging process of automotive electronics and consumer electronics, and meets the requirements of EU RoHS environmental protection directives.
发布询价
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