基本信息
This low-temperature electronic packaging ceramic particle adhesive is specially designed for the assembly and packaging of precision electronic components. It uses zirconia ceramic particles as the reinforced filler, with excellent insulation performance and no corrosion to electronic components. It supports both UV fast curing for mass production and room temperature curing for small-batch processing, meeting the production needs of different electronic manufacturing scenarios. It complies with RoHS and REACH environmental protection standards, making it suitable for the production of high-end electronic products such as semiconductors and aerospace electronics.
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