基本信息
This high-purity electronic grade ethylene urea is a customized high-end chemical auxiliary for semiconductor packaging industry. Through three-time recrystallization purification process, the impurities are controlled at an extremely low level, which effectively improves the curing efficiency and forming stability of epoxy packaging materials. It solves the industry pain points such as solder joint defects and insulation performance degradation caused by traditional curing agents, mainly serving high-end chip packaging, power device manufacturing and other fields, and complies with EU REACH and US TSCA environmental protection certification standards.
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