基本信息
This fully automatic vacuum plasma cleaning machine is designed for semiconductor packaging, pre-pressing treatment of multilayer PCB boards and other industries. It uses low-temperature plasma technology combined with a vacuum environment to efficiently remove organic pollutants, micro dust and oxide layers on the workpiece surface, and improve the adhesion and wettability of the workpiece surface. It solves the pain point that traditional cleaning methods cannot achieve surface modification, meeting the high-precision cleaning and surface treatment requirements of the semiconductor industry.
发布询价
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